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Virtualization chip maker 3Leaf Systems has raised $35 million in a third round of funding to expand its productions. LSI Corp led the round, while other participants included: Alloy Ventures, Enterprise Partners Venture Capital, Intel Capital & Storm Ventures. Virtualization technology is on the boom lately as its production does not require a number of machines or other technology, and saves a lot of money for big companies.

Santa Carla, Calif-based 3Leaf stated that it would make use of the funds to accelerate development and expand its sales and marketing. 3Leaf’s first product is most likely to be launched in 2009, being a custom chip using the HyperTransport bus. The company adds to the growing industry of communication chips.

[via : VentureBeat]